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SPC5674FF3MVR3 Tech Specifications

NXP  SPC5674FF3MVR3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 416-BBGA
Surface Mount YES
Data Converters A/D 64x12b
Number of I/Os 32I/Os
ROM(word) 4194304
Usage Level Automotive grade
Operating Temperature -40°C~125°C TA
Packaging Tray
Series MPC56xx Qorivva
Published 2008
JESD-609 Code e2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 416Terminations
ECCN Code 3A991.A.2
Terminal Finish TIN COPPER/TIN SILVER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number SPC5674
JESD-30 Code S-PBGA-B416
Qualification Status Not Qualified
Power Supplies 1.23.35V
Supply Voltage-Min (Vsup) 1.14V
Oscillator Type External
Speed 264MHz
RAM Size 256K x 8
Voltage - Supply (Vcc/Vdd) 1.08V~5.25V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor e200z7
Peripherals DMA, POR, PWM
Clock Frequency 40MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 4MB 4M x 8
Connectivity CANbus, SCI, SPI
Supply Current-Max 1000mA
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
Screening Level AEC-Q100
Length 27mm
Width 27mm
RoHS Status ROHS3 Compliant
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