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SE97PW,118 Tech Specifications

NXP  SE97PW,118 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Surface Mount YES
Operating Temperature -40°C~125°C
Packaging Cut Tape (CT)
Published 2009
JESD-609 Code e4
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8Terminations
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Voltage - Supply 3V~3.6V
Base Part Number SE97
Function Temp Monitoring System (Sensor), DIMM DDR Memory
Body Length or Diameter 4.4mm
Body Breadth 3 mm
Output Type I2C/SMBus
Power Supplies 1.8/3.3V
Termination Type SOLDER
Number of Bits 11Bits
Accuracy ±3°C(Max)
Topology ADC (Sigma Delta), Comparator, Register Bank
Sensor Type Internal
Sensors/Transducers Type TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
Housing PLASTIC
Output Interface Type 2-WIRE INTERFACE
Output Alarm Yes
Sensing Temperature -40°C~125°C
Body Height 1.1mm
RoHS Status ROHS3 Compliant
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SE97PW,118 Documents

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