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S9S08SG8E2CTJR Tech Specifications

NXP  S9S08SG8E2CTJR technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Surface Mount YES
Package / Case 20-TSSOP (0.173, 4.40mm Width)
Mounting Type Surface Mount
ROM(word) 8192
Number of I/Os 16I/Os
Data Converters A/D 12x10b
Usage Level Automotive grade
Packaging Tape & Reel (TR)
Series S08
Published 1999
Operating Temperature -40°C~85°C TA
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 20Terminations
ECCN Code EAR99
Terminal Finish MATTE TIN
HTS Code 8542.31.00.01
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number S9S08SG8
JESD-30 Code R-PDSO-G20
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5V
Power Supplies 3/5V
Supply Voltage-Min (Vsup) 2.7V
Oscillator Type Internal
Speed 40MHz
RAM Size 512 x 8
Voltage - Supply (Vcc/Vdd) 2.7V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Peripherals LVD, POR, PWM, WDT
Program Memory Type FLASH
Core Size 8-Bit
Program Memory Size 8KB 8K x 8
Connectivity I2C, LINbus, SCI, SPI
Supply Current-Max 120mA
Bit Size 8
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
Screening Level AEC-Q100
Height Seated (Max) 1.2mm
Width 5mm
Length 6.5mm
RoHS Status ROHS3 Compliant
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