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S9S08AW32E5MFGE Tech Specifications
NXP S9S08AW32E5MFGE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 12 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | 44-LQFP | |
| Surface Mount | YES | |
| Data Converters | A/D 8x10b | |
| Number of I/Os | 34I/Os | |
| ROM(word) | 32768 | |
| Usage Level | Automotive grade | |
| Operating Temperature | -40°C~125°C TA | |
| Packaging | Tray | |
| Series | S08 | |
| Published | 2013 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 44Terminations | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | QUAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.8mm | |
| Base Part Number | S9S08AW32 | |
| JESD-30 Code | S-PQFP-G44 | |
| Qualification Status | Not Qualified | |
| Power Supplies | 3/5V | |
| Oscillator Type | Internal | |
| Speed | 40MHz | |
| RAM Size | 2K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.7V~5.5V | |
| Peripherals | LVD, POR, PWM, WDT | |
| Program Memory Type | FLASH | |
| Core Size | 8-Bit | |
| Program Memory Size | 32KB 32K x 8 | |
| Connectivity | I2C, SCI, SPI | |
| Bit Size | 8 | |
| Screening Level | AEC-Q100 | |
| RoHS Status | ROHS3 Compliant |
S9S08AW32E5MFGE Documents
Download datasheets and manufacturer documentation for S9S08AW32E5MFGE
- DatasheetsMC9S08AW60/48/32/16
- PCN Assembly/OriginBurn-In Site Expansion 26/Nov/2013
- Environmental InformationNXP RoHS3 Cert
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