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NX3L2G66GT,115 Tech Specifications

NXP  NX3L2G66GT,115 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 7 Weeks
Mounting Type Surface Mount
Package / Case 8-XFDFN
Surface Mount YES
Operating Temperature -40°C~125°C TA
Packaging Tape & Reel (TR)
Published 2010
JESD-609 Code e4
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8Terminations
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Position DUAL
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Number of Functions 2Functions
Supply Voltage 1.65V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number NX3L2G66G
Output SEPARATE OUTPUT
Pin Count 8
JESD-30 Code R-PDSO-N8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 4.3V
Power Supplies 1.5/3.3V
Number of Channels 1Channel
Number of Circuits 2Circuits
-3db Bandwidth 60MHz
On-State Resistance (Max) 750mOhm
Multiplexer/Demultiplexer Circuit 1:1
Off-state Isolation-Nom 90 dB
Current - Leakage (IS(off)) (Max) 10nA
Channel Capacitance (CS(off), CD(off)) 35pF
On-state Resistance Match-Nom 0.04Ohm
Switch Circuit SPST - NO
Switch Time (Ton, Toff) (Max) 23ns, 8ns
Charge Injection 6pC
Channel-to-Channel Matching (ΔRon) 20m Ω
Switching BREAK-BEFORE-MAKE
Switch-on Time-Max 48ns
Voltage - Supply, Single (V+) 1.4V~4.3V
Normal Position NO
Length 1.95mm
Height Seated (Max) 0.5mm
RoHS Status ROHS3 Compliant
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