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NX3L1T3157GM,115 Tech Specifications

NXP  NX3L1T3157GM,115 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 7 Weeks
Mounting Type Surface Mount
Package / Case 6-XFDFN
Surface Mount YES
Operating Temperature -40°C~125°C TA
Packaging Tape & Reel (TR)
Published 2010
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6Terminations
Terminal Finish Tin (Sn)
Terminal Position DUAL
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 1.65V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number NX3L1T3157G
Output SEPARATE OUTPUT
Pin Count 6
JESD-30 Code R-PDSO-N6
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 4.3V
Number of Channels 1Channel
Number of Circuits 1Circuit
-3db Bandwidth 60MHz
On-State Resistance (Max) 500mOhm
Multiplexer/Demultiplexer Circuit 2:1
Off-state Isolation-Nom 90 dB
Current - Leakage (IS(off)) (Max) 10nA
Channel Capacitance (CS(off), CD(off)) 35pF
On-state Resistance Match-Nom 0.04Ohm
Switch Circuit SPDT
Switch Time (Ton, Toff) (Max) 40ns, 20ns
Charge Injection 15pC
Channel-to-Channel Matching (ΔRon) 20m Ω
Switching BREAK-BEFORE-MAKE
Switch-off Time-Max 90ns
Voltage - Supply, Single (V+) 1.4V~4.3V
Height Seated (Max) 0.5mm
RoHS Status ROHS3 Compliant
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