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NX3L1G53GM,125 Tech Specifications

NXP  NX3L1G53GM,125 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 7 Weeks
Mounting Type Surface Mount
Package / Case 8-XFQFN Exposed Pad
Surface Mount YES
Operating Temperature -40°C~125°C TA
Packaging Tape & Reel (TR)
Published 2009
JESD-609 Code e4
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8Terminations
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 1.65V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number NX3L1G53G
Pin Count 8
JESD-30 Code S-PQCC-N8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 4.3V
Number of Channels 1Channel
Number of Circuits 1Circuit
-3db Bandwidth 60MHz
On-State Resistance (Max) 750mOhm
Multiplexer/Demultiplexer Circuit 2:1
Off-state Isolation-Nom 90 dB
Current - Leakage (IS(off)) (Max) 10nA
Channel Capacitance (CS(off), CD(off)) 35pF
On-state Resistance Match-Nom 0.04Ohm
Switch Circuit SPDT
Switch Time (Ton, Toff) (Max) 24ns, 8ns
Charge Injection 15pC
Channel-to-Channel Matching (ΔRon) 20m Ω
Switching BREAK-BEFORE-MAKE
Switch-on Time-Max 50ns
Switch-off Time-Max 23ns
Voltage - Supply, Single (V+) 1.4V~4.3V
Height Seated (Max) 0.5mm
RoHS Status ROHS3 Compliant
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