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N74F133DT Tech Specifications

NXP  N74F133DT technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 16Terminals
Package Description SOP, SOP16,.25
Package Style SMALL OUTLINE
Moisture Sensitivity Levels 1
Load Capacitance (CL) 50 pF
Package Body Material PLASTIC/EPOXY
Package Equivalence Code SOP16,.25
Reflow Temperature-Max (s) 30
Operating Temperature-Max 70 °C
Rohs Code Yes
Manufacturer Part Number N74F133D-T
Supply Voltage-Nom (Vsup) 5 V
Package Code SOP
Package Shape RECTANGULAR
Manufacturer NXP Semiconductors
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Risk Rank 5.78
Part Package Code SOIC
Prop. 8 ns
JESD-609 Code e4
Terminal Finish NICKEL PALLADIUM GOLD
HTS Code 8542.39.00.01
Subcategory Gates
Packing Method TAPE AND REEL
Technology TTL
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
Pin Count 16
JESD-30 Code R-PDSO-G16
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Power Supplies 5 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 4.5 V
Family F/FAST
Number of Inputs 13Inputs
Seated Height-Max 1.75 mm
Logic IC Type NAND GATE
Max I(ol) 0.02 A
Propagation Delay (tpd) 8 ns
Schmitt Trigger NO
Power Supply Current-Max (ICC) 4 mA
Width 3.9 mm
Length 9.9 mm
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