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MVF30NS151CKU26 Tech Specifications

NXP  MVF30NS151CKU26 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 15 Weeks
Package / Case 176-LQFP Exposed Pad
Surface Mount YES
Number of I/Os 111I/Os
ROM(word) 0
Operating Temperature -40°C~85°C TA
Packaging Tray
Series Vybrid, VF3xx
Published 2002
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 176Terminations
ECCN Code 5A002.A.1
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.23V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MVF30NS151
JESD-30 Code S-PQFP-G176
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 1.16V
Speed 266MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-A5
Bit Size 16
Has ADC YES
DMA Channels YES
PWM Channels NO
DAC Channels YES
CPU Family CORTEX-A5
Voltage - I/O 3.3V
Ethernet 10/100Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, DDR3, DRAM
USB USB 2.0 OTG + PHY (1)
Additional Interfaces CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Co-Processors/DSP Multimedia; NEON™ MPE
ROM Programmability FLASH
Security Features ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Display & Interface Controllers DCU, GPU, LCD, VideoADC, VIU
RoHS Status ROHS3 Compliant
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MVF30NS151CKU26 Documents

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