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MSC8156TAG1000B Tech Specifications

NXP  MSC8156TAG1000B technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 783-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~105°C TJ
Packaging Tray
Series StarCore
Published 2006
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 783Terminations
ECCN Code 3A991.A.2
Type SC3850 Six Core
Terminal Finish TIN SILVER COPPER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B783
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.97V
Interface Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Boundary Scan YES
Low Power Mode YES
Format FIXED POINT
Voltage - I/O 2.50V
Barrel Shifter NO
Internal Bus Architecture SINGLE
Non-Volatile Memory ROM (96kB)
Voltage - Core 1.00V
On Chip Data RAM 576kB
Clock Rate 1GHz
Length 29mm
Height Seated (Max) 3.94mm
Width 29mm
RoHS Status ROHS3 Compliant
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MSC8156TAG1000B Documents

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