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MPC860SRCVR66D4 Tech Specifications
NXP MPC860SRCVR66D4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 12 Weeks | |
| Package / Case | 357-BBGA | |
| Surface Mount | YES | |
| Operating Temperature | -40°C~95°C TA | |
| Packaging | Tray | |
| Series | MPC8xx | |
| Published | 1995 | |
| JESD-609 Code | e1 | |
| Part Status | Not For New Designs | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 357Terminations | |
| ECCN Code | 3A991.A.2 | |
| Terminal Finish | TIN SILVER COPPER | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 245 | |
| Supply Voltage | 3.3V | |
| Terminal Pitch | 1.27mm | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | MPC860 | |
| JESD-30 Code | S-PBGA-B357 | |
| Supply Voltage-Max (Vsup) | 3.465V | |
| Supply Voltage-Min (Vsup) | 3.135V | |
| Speed | 66MHz | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC | |
| Clock Frequency | 50MHz | |
| Bit Size | 32 | |
| Address Bus Width | 32 | |
| Boundary Scan | YES | |
| Low Power Mode | YES | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| Voltage - I/O | 3.3V | |
| Ethernet | 10Mbps (4) | |
| Number of Cores/Bus Width | 1 Core 32-Bit | |
| Graphics Acceleration | No | |
| RAM Controllers | DRAM | |
| Additional Interfaces | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | |
| Co-Processors/DSP | Communications; CPM | |
| Length | 25mm | |
| Height Seated (Max) | 2.52mm | |
| RoHS Status | ROHS3 Compliant |
MPC860SRCVR66D4 Documents
Download datasheets and manufacturer documentation for MPC860SRCVR66D4
- DatasheetsMPC860 Family
- Environmental InformationNXP RoHS3 Cert
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