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MPC8569ECVJANKGB Tech Specifications

NXP  MPC8569ECVJANKGB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Surface Mount YES
Package / Case 783-BBGA, FCBGA
Series MPC85xx
Published 2002
Packaging Tray
Operating Temperature -40°C~105°C TA
JESD-609 Code e1
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 783Terminations
ECCN Code 5A002.A.1
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B783
Supply Voltage-Max (Vsup) 1.03V
Power Supplies 12.5/3.3V
Supply Voltage-Min (Vsup) 0.97V
Speed 800MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC e500v2
Clock Frequency 133MHz
Bit Size 32
Address Bus Width 16
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 1.0V 1.5V 1.8V 2.5V 3.3V
Ethernet 10/100Mbps (8), 1Gbps (4)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR2, DDR3, SDRAM
USB USB 2.0 (1)
Additional Interfaces DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART
Co-Processors/DSP Communications; QUICC Engine, Security; SEC
Security Features Cryptography, Random Number Generator
Height Seated (Max) 3.94mm
Length 29mm
RoHS Status ROHS3 Compliant
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