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MPC855TVR66D4 Tech Specifications

NXP  MPC855TVR66D4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case 357-BBGA
Surface Mount YES
Operating Temperature 0°C~95°C TA
Packaging Tray
Series MPC8xx
Published 2002
JESD-609 Code e1
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 357Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number MPC855
JESD-30 Code S-PBGA-B357
Supply Voltage-Max (Vsup) 3.465V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3.135V
Speed 66MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Clock Frequency 50MHz
Bit Size 32
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 3.3V
Ethernet 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Co-Processors/DSP Communications; CPM
Length 25mm
Height Seated (Max) 2.52mm
RoHS Status ROHS3 Compliant
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