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MPC8313EVRAGDC Tech Specifications

NXP  MPC8313EVRAGDC technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 8 Weeks
Package / Case 516-BBGA Exposed Pad
Surface Mount YES
Operating Temperature (Max.) 105°C
Packaging Tray
Published 2002
JESD-609 Code e2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 516Terminations
ECCN Code 5A002.A.1
Terminal Finish TIN COPPER/TIN SILVER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MPC8313
JESD-30 Code S-PBGA-B516
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.05V
Power Supplies 11.8/2.53.3V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 0.95V
Speed 400 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Address Bus Width 15
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FLOATING POINT
Integrated Cache YES
Length 27mm
Height Seated (Max) 2.55mm
Width 27mm
RoHS Status ROHS3 Compliant
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MPC8313EVRAGDC Documents

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