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MMDS20254HT1 Tech Specifications
NXP MMDS20254HT1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 14 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | 32-VFQFN Exposed Pad | |
| Surface Mount | YES | |
| Packaging | Tape & Reel (TR) | |
| Published | 2011 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 32Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Matte Tin (Sn) | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | QUAD | |
| Terminal Form | NO LEAD | |
| Peak Reflow Temperature (Cel) | 260 | |
| Supply Voltage | 5V | |
| Terminal Pitch | 0.5mm | |
| Frequency | 1.8GHz~2.2GHz | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| JESD-30 Code | S-PQCC-N32 | |
| Function | Advanced Doherty Alignment Module | |
| Telecom IC Type | TELECOM CIRCUIT | |
| RF Type | Cellular | |
| Length | 6mm | |
| Height Seated (Max) | 0.9mm | |
| Width | 6mm | |
| RoHS Status | ROHS3 Compliant |
MMDS20254HT1 Documents
Download datasheets and manufacturer documentation for MMDS20254HT1
- PCN Assembly/OriginSecond Source Assembly 03/Jun/2016
- Environmental InformationNXP RoHS3 Cert
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