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MKL26Z256VLH4 Tech Specifications

NXP  MKL26Z256VLH4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 64-LQFP
Surface Mount YES
Data Converters A/D - 16bit; D/A - 12bit
Number of I/Os 50I/Os
ROM(word) 262144
Operating Temperature -40°C~105°C TA
Packaging Tray
Series Kinetis KL2
Published 2002
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MKL26Z256
JESD-30 Code S-PQFP-G64
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.3V
Supply Voltage-Min (Vsup) 1.71V
Oscillator Type Internal
Speed 48MHz
RAM Size 32K x 8
Voltage - Supply (Vcc/Vdd) 1.71V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-M0+
Peripherals Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Clock Frequency 48MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 256KB 256K x 8
Connectivity I2C, LINbus, SPI, UART/USART, USB, USB OTG
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES
CPU Family CORTEX-M0
Length 10mm
Width 10mm
RoHS Status ROHS3 Compliant
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