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MKE04Z128VLD4 Tech Specifications

NXP  MKE04Z128VLD4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 20 Weeks
Mounting Type Surface Mount
Package / Case 44-LQFP
Data Converters A/D 12x12b; D/A 2x6b
Number of I/Os 38I/Os
Operating Temperature -40°C~105°C TA
Packaging Tray
Series Kinetis KE04
Published 2014
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Oscillator Type Internal
Speed 48MHz
RAM Size 16K x 8
Voltage - Supply (Vcc/Vdd) 2.7V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-M0+
Peripherals LVD, PWM, WDT
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 128KB 128K x 8
Connectivity I2C, SPI, UART/USART
RoHS Status ROHS3 Compliant
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MKE04Z128VLD4 Documents

Download datasheets and manufacturer documentation for   MKE04Z128VLD4

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