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MKE02Z64VLD4 Tech Specifications

NXP  MKE02Z64VLD4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 20 Weeks
Mounting Type Surface Mount
Package / Case 44-LQFP
Surface Mount YES
Data Converters A/D 16x12b; D/A 2x6b
Number of I/Os 37I/Os
RAM(byte) 4096
ROM(word) 65536
Operating Temperature -40°C~105°C TA
Packaging Tray
Series Kinetis KE02
Published 2002
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 44Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
Additional Feature RAM SIZE CONSIDERED FROM THE MFR WEBSITE
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PQFP-G44
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 2.7V
Oscillator Type Internal
Speed 40MHz
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 2.7V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-M0+
Peripherals LVD, PWM, WDT
Clock Frequency 20MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 64KB 64K x 8
Connectivity I2C, SPI, UART/USART
Bit Size 32
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
EEPROM Size 256 x 8
On Chip Program ROM Width 8
Length 10mm
Width 10mm
RoHS Status ROHS3 Compliant
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MKE02Z64VLD4 Documents

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