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MK82FN256VDC15 Tech Specifications
NXP MK82FN256VDC15 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 13 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | 121-XFBGA | |
| Data Converters | A/D 18x16b; D/A 2x6b, 1x12b | |
| Number of I/Os | 87I/Os | |
| Operating Temperature | -40°C~105°C TA | |
| Packaging | Tray | |
| Series | Kinetis K8x | |
| Published | 2014 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| ECCN Code | 5A992 | |
| HTS Code | 8542.31.00.01 | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Oscillator Type | Internal | |
| Speed | 150MHz | |
| RAM Size | 256K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.71V~3.6V | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC | |
| Core Processor | ARM® Cortex®-M4 | |
| Peripherals | DMA, I2S, LVD, POR, PWM | |
| Program Memory Type | FLASH | |
| Core Size | 32-Bit | |
| Program Memory Size | 256KB 256K x 8 | |
| Connectivity | EBI/EMI, I2C, SPI, UART/USART, USB OTG | |
| RoHS Status | ROHS3 Compliant |
MK82FN256VDC15 Documents
Download datasheets and manufacturer documentation for MK82FN256VDC15
- PCN Packaging12NC 27/Nov/2016 Mult Dev ShipBox Chg 14/Feb/2022
- PCN Design/SpecificationMK8YY 21/Jan/2017
- PCN Assembly/OriginMult Dev Assembly Chg 19/Dec/2018
- Environmental InformationNXP RoHS3 Cert
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