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MK60DN512ZVLL10 Tech Specifications

NXP  MK60DN512ZVLL10 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 15 Weeks
Mounting Type Surface Mount
Package / Case 100-LQFP
Surface Mount YES
Data Converters A/D 33x16b; D/A 1x12b
Number of I/Os 66I/Os
Operating Temperature -40°C~105°C TA
Packaging Tray
Series Kinetis K60
Published 2002
JESD-609 Code e3
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 100Terminations
ECCN Code 3A991.A.2
Terminal Finish MATTE TIN
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number K60DN512
JESD-30 Code S-PQFP-G100
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 1.71V
Oscillator Type Internal
Speed 100MHz
RAM Size 128K x 8
Voltage - Supply (Vcc/Vdd) 1.71V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-M4
Peripherals DMA, I2S, LVD, POR, PWM, WDT
Clock Frequency 32MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 512KB 512K x 8
Connectivity CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES
Length 14mm
Height Seated (Max) 1.7mm
Width 14mm
RoHS Status ROHS3 Compliant
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