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MK53DX256CMD10 Tech Specifications

NXP  MK53DX256CMD10 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 144-LBGA
Surface Mount YES
Data Converters A/D 41x16b; D/A 2x12b
Number of I/Os 94I/Os
ROM(word) 262144
Operating Temperature -40°C~85°C TA
Packaging Tray
Series Kinetis K50
Published 2002
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144Terminations
ECCN Code 3A991.A.2
Terminal Finish TIN SILVER COPPER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MK53DX256
JESD-30 Code S-PBGA-B144
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.3V
Supply Voltage-Min (Vsup) 1.71V
Oscillator Type Internal
Speed 100MHz
RAM Size 128K x 8
Voltage - Supply (Vcc/Vdd) 1.71V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-M4
Peripherals DMA, I2S, LCD, LVD, POR, PWM, WDT
Clock Frequency 50MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 256KB 256K x 8
Connectivity EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES
EEPROM Size 4K x 8
CPU Family CORTEX-M4
Length 13mm
Width 13mm
RoHS Status ROHS3 Compliant
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MK53DX256CMD10 Documents

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