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MK30DX128VMC7 Tech Specifications

NXP  MK30DX128VMC7 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 121-LFBGA
Surface Mount YES
Data Converters A/D 38x16b; D/A 1x12b
Number of I/Os 74I/Os
ROM(word) 131072
Operating Temperature -40°C~105°C TA
Packaging Tray
Series Kinetis K30
Published 2012
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 121Terminations
ECCN Code 3A991.A.2
Terminal Finish TIN SILVER COPPER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MK30DX128
JESD-30 Code S-PBGA-B121
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.3V
Supply Voltage-Min (Vsup) 1.71V
Oscillator Type Internal
Speed 72MHz
RAM Size 32K x 8
Voltage - Supply (Vcc/Vdd) 1.71V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor ARM® Cortex®-M4
Peripherals DMA, I2S, LCD, LVD, POR, PWM, WDT
Clock Frequency 50MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 128KB 128K x 8
Connectivity CANbus, I2C, IrDA, SPI, UART/USART
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES
EEPROM Size 2K x 8
CPU Family CORTEX-M4
Length 8mm
Width 8mm
RoHS Status ROHS3 Compliant
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MK30DX128VMC7 Documents

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