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MCZ33810EK Tech Specifications

NXP  MCZ33810EK technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 32-SSOP (0.295, 7.50mm Width) Exposed Pad
Surface Mount YES
Operating Temperature -40°C~125°C
Packaging Tube
Published 2006
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 32Terminations
ECCN Code EAR99
Terminal Finish MATTE TIN
Applications Automotive
HTS Code 8542.39.00.01
Voltage - Supply 4.5V~36V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 13V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MCZ33810
JESD-30 Code R-PDSO-G32
Qualification Status Not Qualified
Power Supplies 3.3/59/18V
Current - Supply 10mA
Output Current-Max 1A
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER
Driver Number of Bits 8Bits
Turn On Time 5 µs
Output Peak Current Limit-Nom 6A
Turn Off Time 5 µs
Built-in Protections TRANSIENT; OVER CURRENT
Output Current Flow Direction SINK
Length 11mm
Height Seated (Max) 2.45mm
Width 7.5mm
RoHS Status ROHS3 Compliant
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MCZ33810EK Documents

Download datasheets and manufacturer documentation for   MCZ33810EK

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