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MCIMX6DP6AVT8AB Tech Specifications
NXP MCIMX6DP6AVT8AB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 12 Weeks | |
| Package / Case | 624-FBGA, FCBGA | |
| Surface Mount | YES | |
| Operating Temperature | -40°C~125°C TJ | |
| Packaging | Tray | |
| Series | i.MX6DP | |
| Published | 2002 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 624Terminations | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Terminal Pitch | 0.8mm | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| JESD-30 Code | S-PBGA-B624 | |
| Supply Voltage-Max (Vsup) | 1.5V | |
| Supply Voltage-Min (Vsup) | 1.225V | |
| Speed | 852MHz | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC | |
| Core Processor | ARM® Cortex®-A9 | |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.3V | |
| Ethernet | 10/100/1000Mbps (1) | |
| Number of Cores/Bus Width | 2 Core 32-Bit | |
| Graphics Acceleration | Yes | |
| RAM Controllers | LPDDR2, DDR3L, DDR3 | |
| USB | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | |
| Additional Interfaces | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | |
| Co-Processors/DSP | Multimedia; NEON™ SIMD | |
| Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | |
| Display & Interface Controllers | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | |
| SATA | SATA 3Gbps (1) | |
| Length | 21mm | |
| Height Seated (Max) | 2.16mm | |
| RoHS Status | ROHS3 Compliant |
MCIMX6DP6AVT8AB Documents
Download datasheets and manufacturer documentation for MCIMX6DP6AVT8AB
- DatasheetsMCIMX6(D,Q)PxAVTx(A,B)
- PCN PackagingMult Devices Label 20/Dec/2017 Mult Dev ShipBox Chg 14/Feb/2022
- PCN Design/SpecificationMCIMX6YYY 08/May/2019 Manual Updates 14/Jul/2019
- PCN Assembly/OriginMCIMX6YYY 20/Aug/2018
- Environmental InformationNXP RoHS3 Cert
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