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MCIMX6D5EYM10ADR Tech Specifications
NXP MCIMX6D5EYM10ADR technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 15 Weeks | |
| Package / Case | 624-LFBGA, FCBGA | |
| Operating Temperature | -20°C~105°C TJ | |
| Packaging | Tape & Reel (TR) | |
| Series | i.MX6D | |
| Published | 2011 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Speed | 1.0GHz | |
| Core Processor | ARM® Cortex®-A9 | |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.3V | |
| Ethernet | 10/100/1000Mbps (1) | |
| Number of Cores/Bus Width | 2 Core 32-Bit | |
| Graphics Acceleration | Yes | |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 | |
| USB | USB 2.0 + PHY (4) | |
| Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |
| Co-Processors/DSP | Multimedia; NEON™ SIMD | |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | |
| Display & Interface Controllers | Keypad, LCD | |
| SATA | SATA 3Gbps (1) | |
| RoHS Status | ROHS3 Compliant |
MCIMX6D5EYM10ADR Documents
Download datasheets and manufacturer documentation for MCIMX6D5EYM10ADR
- Datasheetsi.MX 6Dual/6Quad Chip Errata i.MX 6 Series Fact Sheet
- PCN Assembly/Origini.MX6Q/D Assembly Site 24/Jan/2014
- Environmental InformationNXP RoHS3 Cert
- PCN OtherMult Device Des Update-New Subs 15/Sep/2017
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