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MCIMX257CJM4AR2 Tech Specifications

NXP  MCIMX257CJM4AR2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 15 Weeks
Package / Case 400-LFBGA
Surface Mount YES
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Series i.MX25
Published 2008
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 400Terminations
ECCN Code 5A992
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.45V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PBGA-B400
Supply Voltage-Max (Vsup) 1.52V
Supply Voltage-Min (Vsup) 1.38V
Speed 400MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR
Core Processor ARM926EJ-S
Clock Frequency 24MHz
Bit Size 32
Address Bus Width 26
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 16
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 2.0V 2.5V 2.7V 3.0V 3.3V
Ethernet 10/100Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers LPDDR, DDR, DDR2
USB USB 2.0 + PHY (2)
Additional Interfaces CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Display & Interface Controllers Keypad, LCD, Touchscreen
Length 17mm
Height Seated (Max) 1.6mm
RoHS Status ROHS3 Compliant
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MCIMX257CJM4AR2 Documents

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