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MCF52235CAL60 Tech Specifications

NXP  MCF52235CAL60 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Surface Mount YES
Package / Case 112-LQFP
Mounting Type Surface Mount
ROM(word) 262144
Number of I/Os 73I/Os
Data Converters A/D 8x12b
Published 2000
Series MCF5223x
Packaging Tray
Operating Temperature -40°C~85°C TA
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 112Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
Additional Feature ALSO OPERATES AT 3V SUPPLY
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MCF52235
JESD-30 Code S-PQFP-G112
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Oscillator Type Internal
Speed 60MHz
RAM Size 32K x 8
Voltage - Supply (Vcc/Vdd) 3V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor Coldfire V2
Peripherals DMA, LVD, POR, PWM, WDT
Clock Frequency 60MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 256KB 256K x 8
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels NO
Width 20mm
Height Seated (Max) 1.6mm
Length 20mm
RoHS Status ROHS3 Compliant
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MCF52235CAL60 Documents

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