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MCF5216CVM66 Tech Specifications

NXP  MCF5216CVM66 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 256-LBGA
Surface Mount YES
Data Converters A/D 8x12b
Number of I/Os 142I/Os
Operating Temperature -40°C~85°C TA
Packaging Tray
Series MCF521x
Published 2002
JESD-609 Code e1
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MCF5216
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Oscillator Type Internal
Speed 66MHz
RAM Size 64K x 8
Voltage - Supply (Vcc/Vdd) 2.7V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor Coldfire V2
Peripherals DMA, LVD, POR, PWM, WDT
Clock Frequency 66.67MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 512KB 512K x 8
Connectivity CANbus, EBI/EMI, I2C, SPI, UART/USART
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels NO
Address Bus Width 24
External Data Bus Width 32
Length 17mm
Height Seated (Max) 1.6mm
Width 17mm
RoHS Status ROHS3 Compliant
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MCF5216CVM66 Documents

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