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MC9S12XEP100MAG Tech Specifications

NXP  MC9S12XEP100MAG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 144-LQFP
Surface Mount YES
Data Converters A/D 24x12b
Number of I/Os 119I/Os
ROM(word) 1048576
Operating Temperature -40°C~125°C TA
Packaging Tray
Series HCS12X
Published 1996
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
Additional Feature IT ALSO REQUIRES 5 V I/O SUPPLY
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.8V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC9S12XEP100
JESD-30 Code S-PQFP-G144
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.98V
Power Supplies 3.3/5V
Supply Voltage-Min (Vsup) 1.72V
Oscillator Type External
Speed 50MHz
RAM Size 64K x 8
Voltage - Supply (Vcc/Vdd) 1.72V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Peripherals LVD, POR, PWM, WDT
Clock Frequency 40MHz
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 1MB 1M x 8
Connectivity CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels NO
Address Bus Width 23
EEPROM Size 4K x 8
CPU Family CPU12
External Data Bus Width 16
Length 20mm
Height Seated (Max) 1.6mm
Width 20mm
RoHS Status ROHS3 Compliant
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MC9S12XEP100MAG Documents

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