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MC9S12XDP512MAL Tech Specifications

NXP  MC9S12XDP512MAL technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 112-LQFP
Surface Mount YES
Data Converters A/D 16x10b
Number of I/Os 91I/Os
ROM(word) 524288
Operating Temperature -40°C~125°C TA
Packaging Tray
Series HCS12X
Published 1996
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 112Terminations
Terminal Finish MATTE TIN
Additional Feature IT ALSO REQUIRES 5 V SUPPLY
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 2.5V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC9S12XDP512
JESD-30 Code S-PQFP-G112
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.75V
Power Supplies 2.55V
Supply Voltage-Min (Vsup) 2.35V
Oscillator Type External
Speed 80MHz
RAM Size 32K x 8
Voltage - Supply (Vcc/Vdd) 2.35V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Peripherals LVD, POR, PWM, WDT
Clock Frequency 80MHz
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 512KB 512K x 8
Connectivity CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Bit Size 16
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels NO
EEPROM Size 4K x 8
CPU Family CPU12
Length 20mm
Height Seated (Max) 1.6mm
Width 20mm
RoHS Status ROHS3 Compliant
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