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MC9S12E64CPVE Tech Specifications

NXP  MC9S12E64CPVE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Surface Mount YES
Package / Case 112-LQFP
Mounting Type Surface Mount
Number of I/Os 92I/Os
Data Converters A/D 16x10b; D/A 2x8b
Published 2003
Series HCS12
Packaging Tray
Operating Temperature -40°C~85°C TA
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 112Terminations
ECCN Code EAR99
Terminal Finish MATTE TIN
Additional Feature ALSO REQUIRES 3.3V OR 5V SUPPLY
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 2.5V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC9S12E64
JESD-30 Code S-PQFP-G112
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.75V
Supply Voltage-Min (Vsup) 2.35V
Oscillator Type Internal
Speed 25MHz
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 2.35V~2.75V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Peripherals POR, PWM, WDT
Clock Frequency 50MHz
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 64KB 64K x 8
Connectivity EBI/EMI, I2C, SCI, SPI
Bit Size 16
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels YES
Address Bus Width 16
External Data Bus Width 16
Width 20mm
Height Seated (Max) 1.6mm
Length 20mm
RoHS Status ROHS3 Compliant
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