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MC9S12D64CPVE Tech Specifications

NXP  MC9S12D64CPVE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 112-LQFP
Surface Mount YES
Data Converters A/D 16x10b
Number of I/Os 91I/Os
ROM(word) 65536
Operating Temperature -40°C~85°C TA
Packaging Tray
Series HCS12
Published 1998
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 112Terminations
Terminal Finish Matte Tin (Sn)
Additional Feature ALSO REQUIRES 5V SUPPLY
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 2.5V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC9S12D64
JESD-30 Code S-PQFP-G112
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.75V
Power Supplies 2.55V
Supply Voltage-Min (Vsup) 2.35V
Oscillator Type Internal
Speed 25MHz
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 2.35V~5.25V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Peripherals PWM, WDT
Clock Frequency 16MHz
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 64KB 64K x 8
Connectivity CANbus, I2C, SCI, SPI
Bit Size 16
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
Address Bus Width 16
EEPROM Size 1K x 8
CPU Family CPU12
External Data Bus Width 16
Length 20mm
Height Seated (Max) 1.6mm
Width 20mm
RoHS Status ROHS3 Compliant
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MC9S12D64CPVE Documents

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