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MC9S08QG4CPAE Tech Specifications

NXP  MC9S08QG4CPAE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Data Converters A/D 4x10b
Number of I/Os 4I/Os
Operating Temperature -40°C~85°C TA
Packaging Tube
Series S08
Published 1999
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 8Terminations
ECCN Code 3A991.A.2
Terminal Finish MATTE TIN
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 3V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number MC9S08QG4
JESD-30 Code R-PDIP-T8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.6V
Supply Voltage-Min (Vsup) 1.8V
Oscillator Type Internal
Speed 20MHz
RAM Size 256 x 8
Voltage - Supply (Vcc/Vdd) 1.8V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Peripherals LVD, POR, PWM, WDT
Clock Frequency 20MHz
Program Memory Type FLASH
Core Size 8-Bit
Program Memory Size 4KB 4K x 8
Connectivity I2C, SCI, SPI
Bit Size 8
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
Length 9.779mm
Width 7.62mm
RoHS Status ROHS3 Compliant
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