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MC9S08QA2CDNE Tech Specifications

NXP  MC9S08QA2CDNE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Surface Mount YES
Data Converters A/D 4x10b
Number of I/Os 4I/Os
Operating Temperature -40°C~85°C TA
Packaging Tube
Series S08
Published 2006
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC9S08QA2
JESD-30 Code R-PDSO-G8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 2/3.3V
Supply Voltage-Min (Vsup) 1.8V
Oscillator Type Internal
Speed 20MHz
RAM Size 160 x 8
Voltage - Supply (Vcc/Vdd) 1.8V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Peripherals LVD, POR, PWM, WDT
Clock Frequency 20MHz
Program Memory Type FLASH
Core Size 8-Bit
Program Memory Size 2KB 2K x 8
Bit Size 8
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
Height Seated (Max) 1.75mm
Width 3.9mm
RoHS Status ROHS3 Compliant
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