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MC9S08PA4MTG Tech Specifications

NXP  MC9S08PA4MTG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 20 Weeks
Mounting Type Surface Mount
Package / Case 16-TSSOP (0.173, 4.40mm Width)
Surface Mount YES
Data Converters A/D 8x12b
Number of I/Os 14I/Os
Operating Temperature -40°C~125°C TA
Packaging Tube
Series S08
Published 2012
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 16Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code R-PDSO-G16
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 2.7V
Oscillator Type Internal
Speed 20MHz
RAM Size 512 x 8
Voltage - Supply (Vcc/Vdd) 2.7V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Peripherals LVD, POR, PWM, WDT
Clock Frequency 20MHz
Program Memory Type FLASH
Core Size 8-Bit
Program Memory Size 4KB 4K x 8
Connectivity LINbus, SPI, UART/USART
Bit Size 8
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
EEPROM Size 128 x 8
Length 5mm
Width 4.4mm
RoHS Status ROHS3 Compliant
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