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MC9S08JM8CLD Tech Specifications

NXP  MC9S08JM8CLD technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 44-LQFP
Surface Mount YES
Data Converters A/D 8x12b
Number of I/Os 33I/Os
Operating Temperature -40°C~85°C TA
Packaging Tray
Series S08
Published 2008
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 44Terminations
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC9S08JM8
JESD-30 Code S-PQFP-G44
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 2.7V
Oscillator Type External
Speed 48MHz
RAM Size 1K x 8
Voltage - Supply (Vcc/Vdd) 2.7V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Peripherals LVD, POR, PWM, WDT
Clock Frequency 16MHz
Program Memory Type FLASH
Core Size 8-Bit
Program Memory Size 8KB 8K x 8
Connectivity I2C, LINbus, SCI, SPI, USB
Bit Size 8
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
Length 10mm
Height Seated (Max) 1.6mm
Width 10mm
RoHS Status ROHS3 Compliant
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