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MC9S08GW64CLK Tech Specifications

NXP  MC9S08GW64CLK technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Package / Case 80-LQFP
Surface Mount YES
Mounting Type Surface Mount
Number of I/Os 45I/Os
ROM(word) 65536
Data Converters A/D 16x16b
Operating Temperature -40°C~85°C TA
Packaging Tray
Series S08
Published 2006
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 80Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
Additional Feature ALSO OPERATES WITH 1.8 V MINIMUM SUPPLY AT 10 MHZ
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC9S08GW64
JESD-30 Code S-PQFP-G80
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 2/3.3V
Supply Voltage-Min (Vsup) 2.15V
Oscillator Type Internal
Speed 20MHz
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 1.8V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Peripherals LCD, PWM, WDT
Clock Frequency 16MHz
Program Memory Type FLASH
Core Size 8-Bit
Program Memory Size 64KB 64K x 8
Connectivity I2C, LINbus, SCI, SPI
Bit Size 8
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
Height Seated (Max) 1.6mm
Length 14mm
Width 14mm
RoHS Status ROHS3 Compliant
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