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MC9S08AW32CPUER Tech Specifications

NXP  MC9S08AW32CPUER technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 64-LQFP
Surface Mount YES
Data Converters A/D 16x10b
Number of I/Os 54I/Os
RAM(byte) 2048
ROM(word) 32768
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Series S08
Published 2000
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PQFP-G64
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5V
Power Supplies 3/5V
Supply Voltage-Min (Vsup) 2.7V
Oscillator Type Internal
Speed 40MHz
RAM Size 2K x 8
Voltage - Supply (Vcc/Vdd) 2.7V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Peripherals LVD, POR, PWM, WDT
Clock Frequency 16MHz
Program Memory Type FLASH
Core Size 8-Bit
Program Memory Size 32KB 32K x 8
Connectivity I2C, SCI, SPI
Bit Size 8
Has ADC YES
DMA Channels YES
PWM Channels YES
Length 10mm
Width 10mm
RoHS Status ROHS3 Compliant
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