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MC912DG128ACPVE Tech Specifications

NXP  MC912DG128ACPVE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 112-LQFP
Surface Mount YES
Data Converters A/D 16x8/10b
Number of I/Os 69I/Os
Operating Temperature -40°C~85°C TA
Packaging Tray
Series HC12
Published 2003
JESD-609 Code e3
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 112Terminations
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC912DG128
JESD-30 Code S-PQFP-G112
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 4.5V
Oscillator Type Internal
Speed 8MHz
RAM Size 8K x 8
Voltage - Supply (Vcc/Vdd) 4.5V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor CPU12
Peripherals POR, PWM, WDT
Clock Frequency 16MHz
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 128KB 128K x 8
Connectivity CANbus, I2C, SCI, SPI
Bit Size 16
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
Address Bus Width 16
EEPROM Size 2K x 8
External Data Bus Width 16
Length 20mm
Height Seated (Max) 1.6mm
Width 20mm
RoHS Status ROHS3 Compliant
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