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MC68LC302AF20CT Tech Specifications
NXP MC68LC302AF20CT technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 8 Weeks | |
| Package / Case | 100-LQFP | |
| Surface Mount | YES | |
| Operating Temperature | 0°C~70°C TA | |
| Packaging | Tray | |
| Series | M683xx | |
| Published | 1995 | |
| JESD-609 Code | e3 | |
| Part Status | Not For New Designs | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 100Terminations | |
| ECCN Code | 3A991.A.2 | |
| Terminal Finish | Matte Tin (Sn) | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | QUAD | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Base Part Number | MC68LC302 | |
| JESD-30 Code | S-PQFP-G100 | |
| Speed | 20MHz | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC | |
| Core Processor | M68000 | |
| Has ADC | NO | |
| DMA Channels | YES | |
| PWM Channels | NO | |
| DAC Channels | NO | |
| Address Bus Width | 20 | |
| External Data Bus Width | 16 | |
| Voltage - I/O | 5.0V | |
| Number of Cores/Bus Width | 1 Core 8/16-Bit | |
| Graphics Acceleration | No | |
| RAM Controllers | DRAM | |
| Additional Interfaces | GCI, IDL, ISDN, NMSI, PCM, SCPI | |
| Co-Processors/DSP | Communications; RISC CPM | |
| ROM Programmability | FLASH | |
| RoHS Status | ROHS3 Compliant |
MC68LC302AF20CT Documents
Download datasheets and manufacturer documentation for MC68LC302AF20CT
- PCN Packaging12NC 27/Nov/2016 Mult Devices Label 20/Dec/2017
- PCN Design/SpecificationTrace Marking Removal 20/Jun/2019
- DatasheetsMC68LC302
- Environmental InformationNXP RoHS3 Cert
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