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MC68711E20CFNE3 Tech Specifications

NXP  MC68711E20CFNE3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 52-LCC (J-Lead)
Surface Mount YES
Data Converters A/D 8x8b
Number of I/Os 38I/Os
Operating Temperature -40°C~85°C TA
Packaging Tube
Series HC11
Published 2005
JESD-609 Code e3
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 52Terminations
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Additional Feature SEATED HEIGHT CALCULATED
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form J BEND
Peak Reflow Temperature (Cel) 250
Supply Voltage 5V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number MC68711
JESD-30 Code S-PQCC-J52
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 4.5V
Oscillator Type Internal
Speed 3MHz
RAM Size 768 x 8
Voltage - Supply (Vcc/Vdd) 4.5V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Peripherals POR, WDT
Clock Frequency 12MHz
Program Memory Type OTP
Core Size 8-Bit
Program Memory Size 20KB 20K x 8
Connectivity SCI, SPI
Bit Size 8
Has ADC YES
DMA Channels NO
PWM Channels NO
DAC Channels NO
Address Bus Width 16
EEPROM Size 512 x 8
External Data Bus Width 8
Length 19.125mm
Height Seated (Max) 5.08mm
Width 19.125mm
RoHS Status ROHS3 Compliant
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MC68711E20CFNE3 Documents

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