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MC56F8323VFBE Tech Specifications

NXP  MC56F8323VFBE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 64-LQFP
Surface Mount YES
Data Converters A/D 8x12b
Number of I/Os 27I/Os
Operating Temperature -40°C~105°C TA
Packaging Tray
Series 56F8xxx
Published 1998
JESD-609 Code e3
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
Additional Feature ALSO REQUIRES 3.3V SUPPLY
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 2.5V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC56F8323
JESD-30 Code S-PQFP-G64
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.75V
Supply Voltage-Min (Vsup) 2.25V
Oscillator Type Internal
Speed 60MHz
RAM Size 12K x 8
Voltage - Supply (Vcc/Vdd) 2.25V~3.6V
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER
Core Processor 56800E
Peripherals POR, PWM, Temp Sensor, WDT
Clock Frequency 120MHz
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 32KB 16K x 16
Connectivity CANbus, SCI, SPI
Boundary Scan YES
Low Power Mode YES
Format FIXED POINT
Barrel Shifter YES
Internal Bus Architecture MULTIPLE
Length 10mm
Height Seated (Max) 1.6mm
Width 10mm
RoHS Status ROHS3 Compliant
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