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MC56F8257VLH Tech Specifications

NXP  MC56F8257VLH technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 64-LQFP
Surface Mount YES
Data Converters A/D 16x12b; D/A 1x12b
Number of I/Os 54I/Os
ROM(word) 65536
Operating Temperature -40°C~105°C TA
Packaging Tray
Series 56F8xxx
Published 1998
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC56F8257
JESD-30 Code S-PQFP-G64
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Oscillator Type Internal
Speed 60MHz
RAM Size 4K x 16
Voltage - Supply (Vcc/Vdd) 3V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor 56800E
Peripherals LVD, POR, PWM, WDT
Clock Frequency 16MHz
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 64KB 32K x 16
Connectivity CANbus, I2C, LINbus, SCI, SPI
Bit Size 16
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels YES
Length 10mm
Height Seated (Max) 1.6mm
Width 10mm
RoHS Status ROHS3 Compliant
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