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MC56F8155VFGE Tech Specifications

NXP  MC56F8155VFGE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 128-LQFP
Surface Mount YES
Data Converters A/D 16x12b
Number of I/Os 49I/Os
ROM(word) 262144
Operating Temperature -40°C~105°C TA
Packaging Tray
Series 56F8xxx
Published 1998
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 128Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
Additional Feature ALSO REQUIRES 3.3V SUPPLY
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 2.5V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC56F8155
JESD-30 Code R-PQFP-G128
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.75V
Power Supplies 2.53.3V
Supply Voltage-Min (Vsup) 2.25V
Oscillator Type External
Speed 40MHz
RAM Size 8K x 16
Voltage - Supply (Vcc/Vdd) 2.25V~3.6V
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER
Core Processor 56800E
Peripherals POR, PWM, WDT
Clock Frequency 120MHz
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 256KB 128K x 16
Connectivity EBI/EMI, SCI, SPI
Bit Size 16
Address Bus Width 11
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 4
Format FIXED POINT
Barrel Shifter YES
Internal Bus Architecture MULTIPLE
Length 20mm
Height Seated (Max) 1.6mm
Width 14mm
RoHS Status ROHS3 Compliant
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