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MC33889BPEG Tech Specifications

NXP  MC33889BPEG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 28-SOIC (0.295, 7.50mm Width)
Surface Mount YES
Operating Temperature (Max.) 125°C
Operating Temperature (Min.) -40°C
Packaging Tube
Published 2003
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 28Terminations
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Applications System Basis Chip
HTS Code 8542.39.00.01
Voltage - Supply 5V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 13.5V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC33889
JESD-30 Code R-PDSO-G28
Qualification Status Not Qualified
Power Supplies 5.5/18V
Temperature Grade AUTOMOTIVE
Interface CAN
Data Rate 125 Mbps
Telecom IC Type INTERFACE CIRCUIT
Number of Transceivers 1Transceiver
Length 17.925mm
Height Seated (Max) 2.65mm
Width 7.5mm
RoHS Status ROHS3 Compliant
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MC33889BPEG Documents

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