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MC33883HEGR2 Tech Specifications

NXP  MC33883HEGR2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 20-SOIC (0.295, 7.50mm Width)
Surface Mount YES
Driver Configuration Half-Bridge
Logic voltage-VIL, VIH 0.8V 2V
Operating Temperature -40°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2003
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 20Terminations
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Additional Feature ALSO REQUIRED 5.5V TO 28V
Voltage - Supply 5.5V~28V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 12V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC33883
JESD-30 Code R-PDSO-G20
Input Type Non-Inverting
Rise / Fall Time (Typ) 80ns 80ns
Interface IC Type FULL BRIDGE BASED MOSFET DRIVER
Channel Type Independent
Number of Drivers 4Drivers
Turn On Time 0.18 µs
Gate Type N-Channel MOSFET
Current - Peak Output (Source, Sink) 1A 1A
High Side Driver YES
Turn Off Time 0.18 µs
High Side Voltage - Max (Bootstrap) 55V
Length 12.8mm
Height Seated (Max) 2.65mm
Width 7.5mm
RoHS Status ROHS3 Compliant
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MC33883HEGR2 Documents

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