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MC33790HEGR2 Tech Specifications

NXP  MC33790HEGR2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 18 Weeks
Mounting Type Surface Mount
Package / Case 16-SOIC (0.295, 7.50mm Width)
Surface Mount YES
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Published 2003
JESD-609 Code e3
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 16Terminations
ECCN Code EAR99
Type Distributed Systems Interface
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 5V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC33790
JESD-30 Code R-PDSO-G16
Input Type Logic
Current - Supply 1mA
Length 10.3mm
Height Seated (Max) 2.65mm
Width 7.5mm
RoHS Status ROHS3 Compliant
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MC33790HEGR2 Documents

Download datasheets and manufacturer documentation for   MC33790HEGR2

MC33790HEGR2 brand manufacturers: NXP USA Inc., Twicea stock, MC33790HEGR2 reference price.NXP USA Inc.. MC33790HEGR2 parameters, MC33790HEGR2 Datasheet PDF and pin diagram description download.You can use the MC33790HEGR2 Interface - Sensor and Detector Interfaces, DSP Datesheet PDF, find MC33790HEGR2 pin diagram and circuit diagram and usage method of function,MC33790HEGR2 electronics tutorials.You can download from the Twicea.