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MC33662LEFR2 Tech Specifications

NXP  MC33662LEFR2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Surface Mount YES
Usage Level Automotive grade
Operating Temperature -40°C~125°C
Packaging Tape & Reel (TR)
Published 2003
JESD-609 Code e3
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
ECCN Code EAR99
Type Transceiver
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Voltage - Supply 7V~18V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 13.5V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC33662
JESD-30 Code R-PDSO-G8
Qualification Status Not Qualified
Data Rate 20kbps
Protocol LINbus
Number of Drivers/Receivers 1/1Drivers/Receiver
Duplex Half
Receiver Hysteresis 175mV
Length 4.9mm
Height Seated (Max) 1.75mm
Width 3.9mm
RoHS Status ROHS3 Compliant
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MC33662LEFR2 Documents

Download datasheets and manufacturer documentation for   MC33662LEFR2

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