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MC33660BEF Tech Specifications
NXP MC33660BEF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 12 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-SOIC (0.154, 3.90mm Width) | |
| Surface Mount | YES | |
| Operating Temperature (Max.) | 125°C | |
| Operating Temperature (Min.) | -40°C | |
| Usage Level | Automotive grade | |
| Packaging | Tube | |
| Published | 2006 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 8Terminations | |
| ECCN Code | EAR99 | |
| Applications | Automotive | |
| HTS Code | 8542.39.00.01 | |
| Voltage - Supply | 8V~18V | |
| Terminal Position | DUAL | |
| Terminal Form | NO LEAD | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Supply Voltage | 5V | |
| Terminal Pitch | 1.27mm | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | R-PDSO-N8 | |
| Interface | Serial Link Bus Interface | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Length | 4.9mm | |
| Height Seated (Max) | 1.75mm | |
| Width | 3.9mm | |
| RoHS Status | ROHS3 Compliant |
MC33660BEF Documents
Download datasheets and manufacturer documentation for MC33660BEF
- PCN PackagingMult Devices Label 20/Dec/2017 Mult Dev ShipBox Chg 14/Feb/2022
- DatasheetsMC33660(B)EF
- Environmental InformationNXP RoHS3 Cert
- PCN Assembly/OriginMult Dev Test Chg 18/Nov/2018
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