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MC17XSF500EK Tech Specifications

NXP  MC17XSF500EK technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 18 Weeks
Mounting Type Surface Mount
Package / Case 32-SSOP (0.295, 7.50mm Width) Exposed Pad
Surface Mount YES
Operating Temperature -40°C~125°C TA
Packaging Tube
Published 2011
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 32Terminations
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC17XSF500
JESD-30 Code R-PDSO-G32
Number of Outputs 5Outputs
Qualification Status Not Qualified
Output Type N-Channel
Interface SPI
Output Configuration High Side
Voltage - Supply (Vcc/Vdd) 4.5V~5.5V
Switch Type General Purpose
Ratio - Input:Output 1:1
Voltage - Load 7V~18V
Driver Number of Bits 5Bits
Fault Protection Current Limiting (Fixed), Open Load Detect, Over Temperature
Rds On (Typ) 17m Ω
RoHS Status ROHS3 Compliant
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MC17XSF500EK Documents

Download datasheets and manufacturer documentation for   MC17XSF500EK

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